Services
1. HiTransferTM AlSiC series HiTransferTM AlSiC Based Material Properties
2. AlSiC products design guidelines (1) Main features of AlSiC material l Adjustable coefficient of thermal expansio: can well matched with semiconductor chip materials such as Si、GaAs、AlN; l High thermal conductivity: much higher than Kovar, can spread heat efficiently l Low density: much lower than W/Cu、Mo/Cu and Kovar, can greatly reduce weight l High specific Young’s Modulus: 4 times of Kovar and W/Cu, 2 times of Mo/Cu. Comparison of properties of AlSiC and other thermal management materials
(2) Size and shape tolerance of machined AlSiC component We can machine AlSiC components including plates and housings by means of various machenical methods such as milling, grinding, drill and EDM. The size and shape tolerance is as follows: l flatness: ³0.05mm (100mm) l size tolerance: ±0.02mm (max) l surface finish: ³1.6mm l hole diameter: F³0.3mm l internal radius: R³1.0mm l inside edge break radius: R³0.1mm l thread hole: M³3.0mm
3. (1) high strength SiC preform preparation technique By use of specially designed inorganic binder, the prepared SiC preform has a high strength up to 20MPa (three-point bending), which can withstand the high pressure during infiltration process. (2) high reliable and efficient vacuum aid pressure infiltration technique The process of aluminium molten liquid infiltrating into the porous SiC preform has been elaborately designed to achive high reliability and efficiency. The adoption of high vacuum and gas pressure technique makes the infiltrated AlSiC composites highly uniform, densified and strengthful. (3) High precision machining technique AlSiC components are machined using ordinary equipment, specially designed tools and optimized parameters. The size and shape tolerance can well meet the various types of packaging applications. (4)High-quality AlSiC Cladding Technique AlSiC surface can be electroless plated with Ni-P, Au coating which can meet the 400ºC, 10min, or 420ºC, 5min high-temperature test requirement. |